Thermal Impact of Heat Spreader Co-Planarity to Electronic Packaging
نویسندگان
چکیده
منابع مشابه
Thermal Analysis of laminated (Copper – Graphite) as Heat Spreader Material
Copper-Graphite laminate material design has been analysed, and this proposed composite has the ability to enhance heat dispersing more efficiently compared to the traditional high thermal conductivity with weight associated copper and high thermal resistance graphite. A finite element analysis (FEA) is carried out using the material (Cu – Gr) properties to investigate this proof. The design, t...
متن کاملThermal performance of a flat polymer heat pipe heat spreader under high acceleration
This paper presents the fabrication and application of a micro-scale hybrid wicking structure in a flat polymer-based heat pipe heat spreader, which improves the heat transfer performance under high adverse acceleration. The hybrid wicking structure which enhances evaporation and condensation heat transfer under adverse acceleration consists of 100 μm high, 200 μm wide square electroplated copp...
متن کاملThermal and Thermomechanical Analysis and Testing of Electronic Packaging Systems
A comprehensive thermal and mechanical modeling and experimentation program in advanced packaging has led to the systematic thermomechanical analysis of very large scale integrated device packages, board-level structures, and surface-mounted electronic systems. Model validation and analytical results have been correlated with data from extensive experimental testing, and new techniques have bee...
متن کاملThree Experiments to Analyze the Nature of the Heat Spreader
In this paper, we describe ongoing work to investigate the properties of the heat spreader, and its implication on architecture research. In specific, we conduct two experiments to quantify the heat distribution across the surface of a spreader during normal operation. The first experiment uses T-type thermocouples, to find the temperature difference across different points on the spreader. We ...
متن کاملDesign-Analysis (Thermal and Mechanical) Integration Research for Electronic Packaging
Simulating the characteristics of electronic packages like thermal resistance, thermomechanical stress distribution and electromagnetics is important to guide and verify their design. Since packages consist of densely packed components of varied materials and shapes, the simulation time for generating their finite element analysis (FEA) models can span from hours to days. This paper overviews e...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Advanced Research in Fluid Mechanics and Thermal Sciences
سال: 2020
ISSN: 2289-7879
DOI: 10.37934/arfmts.71.1.19